Chip on Board Services
​CMOS Sensor Inc offers full COB module services including:
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Chip-on-Board circuit
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​Development
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Design
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Manufacturing
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Assembly
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And testing one-stop service
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FR4, FR5, a variety of substrate options such as flexible ceramic substrates.
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Chip on board modules designed exclusively for imaging, power supply, and RF module manufacturing technology.
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Small batch orders from customers are acceptable as well.
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COB and SMD components can coexist
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Accepting COB component aspect ratio less than 1/25
One-Stop Chip-on-Board Module Services
COB Capabilities:
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Capable of handling six different dice
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High Die Bond Accuracy: < 50 µm
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Bond Height Differential: 0.9mm
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Line Quantity/ Program: 3000 Max
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Wire Diameter: 0.7mil ~ 1.3 mil
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Loop Shape Options: 11Max
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Bond Placement Error: 1st →3.5µm, 2nd →12.5µm
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Ball Size:1.4~3 wire diameter, repeatability →0.2mil
